Blog

Method of making on-chip signal paths with electrical and physical connections

Background technique: 1. Numerous items such as smartphones, smart watches, tablets, automobiles, aerial drones, appliances, aircraft, motion aids, an

view more

Pore array layer structure, precoating method, film forming method and relate...

Technical implementation elements: 3. The embodiments of the present technology provide a hole array layer structure, a precoating method, a film form

view more

Hole array layer structure, pre-coating method, film-forming method, and rela...

1. The present technology belongs to the technical field of biological detection, and in particular relates to a hole array layer structure, a precoat

view more

A nanocomposite system and a method for researching nanomaterials, technical ...

Technical implementation elements: 5. The technical problem to be solved by the present invention is: to provide a nanometer integrated system and a m

view more

A nanocomposite system and method for researching nanomaterials

1. The present invention relates to the field of research-level scientific research equipment in nanoscience, and in particular, to the field of a nan

view more

Packaging structure, substrate, packaging method and process technology imple...

Technical implementation elements: 3. The present technology provides a packaging structure, a substrate, and a packaging method, so as to reduce the

view more

Packaging structure, substrate, packaging method and process

1. The present technology relates to the field of chip packaging, and more particularly, to packaging structures, substrates, and packaging methods. B

view more

A MEMS micro-hot plate based on lateral composite dielectric film and its man...

Technical implementation elements: 4. In view of the above technical problems, the present invention provides a mems micro-hot plate based on a transv

view more

A kind of MEMS micro-hot plate based on lateral composite dielectric film and...

A kind of MEMS micro-hot plate based on transverse composite dielectric film and its manufacturing method technical field 1. The present invention rel

view more

The technical realization elements of the post-CMOS release method for the cr...

Technical implementation elements: 5. In order to solve the problem of completing the structure release under the premise of being compatible with cmo

view more

Elements of Technical Implementation Elements of Post-CMOS Release Method for...

Technical implementation elements: 5. In order to solve the problem of completing the structure release under the premise of being compatible with cmo

view more

Cross-beam sensitive structure post-CMOS release method for MEMS vector hydro...

CMOS release method after cross-beam sensitive structure for mems vector hydrophone technical field 1. The present invention relates to the field of s

view more