Packaging structure, substrate, packaging method and process

1. The present technology relates to the field of chip packaging, and more particularly, to packaging structures, substrates, and packaging methods.

Background technique:

2. Micro-electromechanical systems (mems) device-level packaging generally includes processes such as die attachment, wire bonding, capping, and hermetic welding. Studies have shown that package stress from wire bonding and other processes is less than 2% of the total package stress. Taking the mems device as a microsensor as an example, the packaging stress generated by the microsensor bonding process is the most important source of stress in the microsensor packaging process. The packaging stress generated in the microsensor bonding process will directly cause warpage and deformation of the chip microstructure.

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