Packaging structure, substrate, packaging method and process technology implementation elements

Technical implementation elements:

3. The present technology provides a packaging structure, a substrate, and a packaging method, so as to reduce the packaging stress generated in the bonding process of the mems device.

4. In a first aspect, a package structure is provided, the package structure may include: a mems device; The thermal expansion coefficient of the class material is less than the thermal expansion coefficient of the base material of the mems device; and/or, the thermal expansion coefficient of the second class material is greater than the thermal expansion coefficient of the base material of the mems device; the bonding material, located between the mems device and the substrate, is used for Bond the mems device to the substrate.

5. Illustratively, the mems device is a microsensor. For example, the mems device is a sensor chip, or the mems device is a stack structure of a sensor chip and a readout circuit chip. As an example and not a limitation, in the embodiment of the present technology, the mems device may be replaced with a micro sensor.

6. Illustratively, the mems device is bonded to the substrate through an adhesive material, and the materials composing the substrate include the first type of material and the second type of material, which can make the packaging stress and/or deformation generated during the bonding process of the mems device less than Preset threshold. Alternatively, the mems device is bonded to the substrate through an adhesive material, and the materials constituting the substrate include the first type of material and the second type of material, so that the packaging stress and/or deformation generated during the bonding process of the mems device is within a preset range Inside. Alternatively, the mems device is bonded to the substrate through an adhesive material, and the materials constituting the substrate include the first type of material and the second type of material, which can control the packaging stress and/or deformation generated in the mems device bonding process. By way of example and not limitation, in some cases, the package stress generated during the mems device bonding process is zero or near zero. The preset threshold or the preset range can be determined according to actual requirements in practical applications.

7. Based on the above technical solutions, in the package structure provided by the embodiments of the present technology, the design substrate can be composed of a variety of different materials, so that the material properties of the substrate can be controllably adjusted. For example, by adjusting the ratio of different materials constituting the substrate or the thickness or contact area of the layers to which the different materials belong, it is possible to controllably adjust the thermal expansion coefficient, stiffness, density, etc. of the substrate. By controllably adjusting the material properties of the substrate, it is possible to adjust and reduce the packaging stress of the mems device (such as a microsensor) due to the mismatch of the thermal expansion coefficient of the mems device and the substrate during the bonding process, thereby adjusting the deformation of the mems device.

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