A MEMS Sensor Three-dimensional Packaging Device And Three-dimensional Packaging Method And Process

A three-dimensional packaging device and three-dimensional packaging method of mems sensor

technical field

1. The present invention relates to a three-dimensional packaging device and a three-dimensional packaging method for a mems sensor, belonging to the technical field of microelectronics.

Background technique:

2. In recent years, micro-electronic technology (mems, micro-electro-mechanical system) has been involved in all aspects of modern life. With the continuous advancement of technology and market demand, modern electronic products have become more The requirements for reliability are constantly improving, so three-dimensional packaging technologies such as chip packaging (mcp), stack packaging (pop), and system-in-package (sip) are constantly emerging. In 3D packaging, since the single-chip packaging is replaced by 3D devices, the package size and weight are significantly reduced, and the reduction is related to the vertical interconnect density, thermal performance, and required strength.

3. At present, in the chip loading process of the three-dimensional packaging of the sensor, the chip mounter that mounts the chip on the substrate through the chip mounter is in the working process. The entire substrate is first dispensed and then attached. When the chip loader fails and needs to be shut down for maintenance, because some chip loader glues are easy to solidify, when the chip loader is repaired and then started to work, the chip loader cannot play a role in bonding, which will greatly affect the chip placement effect. , Moreover, the substrate on the track of the chip loader is directly exposed, and impurities such as dust are easily dropped on the surface, and the impurities will not only affect the dispensing effect, but also cause the chip to be unable to be mounted normally.

4. Therefore, there is a need for a three-dimensional packaging device for mems sensors, which can realize dispensing and chip mounting at the same time, prevent the mounting glue from solidifying and affect the loading effect, and at the same time, realize the cleaning of the substrate and prevent impurities from affecting the dispensing and chip mounting. Pack.

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