Microelectromechanical System Device And Method For Making The Same

1. The present invention relates to the technical field of micro-mechanical systems, and in particular, to a micro-electromechanical system device and its packaging structure.

Background technique:

2. Micro-electro-mechanical system (mems, micro-electro-mechanical system), also known as micro-electro-mechanical system, micro-system, micro-machine, etc., refers to high-tech devices with a size of several millimeters or even smaller.

3. Microelectromechanical systems devices (or mems devices) are devices fabricated using semiconductor technology to form mechanical and electronic components. Common MEMS devices include resonators, accelerators, pressure sensors, actuators, mirrors, heaters, and printer nozzles. Structural changes, such as cracking, wrinkling, delamination, warping, folding, etc., can even lead to failure of device function.

4. In view of the above-mentioned defects, it is necessary to provide a new MEMS device and its packaging structure.

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