Three-dimensional Packaging Device Of MEMS Sensor And Three-dimensional Packaging Method And Process Technology Realization Elements

Technical implementation elements:

5. The technical problem to be solved by the present invention is: in order to overcome the deficiencies of the prior art, a three-dimensional packaging device of the mems sensor is provided.

6. The technical solution adopted by the present invention to solve the above-mentioned problems is: a three-dimensional packaging device for a mems sensor, comprising a workbench, and a track is fixedly arranged on the top of the workbench, and the track is arranged parallel to the left and right directions, and the track A lens is arranged just above the top, and the lens is fixedly connected to the worktable, a substrate conveying device and a cleaning device are arranged on the track, a mounting device is arranged above the track, and the mounting device is located on the right side of the cleaning device. side;

7. The placement device includes a dispensing mechanism, a suction mechanism and two translation mechanisms. The two translation mechanisms are located on the front side and the rear side of the lens respectively. The dispensing mechanism and the suction mechanism are distributed with the movement of the two translation mechanisms. part connection, the flat

Contact Us：

Email: zhang@pride-cnc.com

Tel: +86-755-23699351

Mob: +8618666663894