Manufacturing method of MEMS device

technical field

1. The present disclosure relates to a mems device with improved stress distribution.

Background technique:

2. As is well known, mems ("Micro Electro Mechanical Systems") electronic devices, such as actuators and/or sensors, are typically formed on a substrate housing a cavity and include movable structures suspended from the cavity above and limited by the elastic element to the fixed area. The substrate, movable structure, and elastic element may be integral, and are typically formed from a semiconductor material such as silicon.

3. These electronic devices also include: one or more actuation and/or detection structures, coupled to the movable structure; and electrical control circuits, integrated in the same substrate or formed in different substrates and Coupling to the actuation and/or detection structure can provide electrical drive signals to the actuation structure and/or receive electrical detection signals from the detection structure.

4. In detail, the actuating structure may cause displacement, eg rotation, of the movable structure when controlled by a corresponding electrical drive signal. Similarly, the detection structure is configured to generate corresponding electrical signals that are a function of the operating conditions of the movable structure, and for example, a function of the rotational range of the movable structure.

5. The electrical control circuit and the actuation and/or detection structure are typically electrically connected to each other by conductive tracks, eg formed from a stack of conductive layers.

6. Conductive rails generally extend over fixed areas, elastic elements, and sometimes partially over movable structures.

7. In use, displacement of the movable structure results in deformation, eg twisting, of the elastic elements which confine the movable structure to the fixed area.

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