Elements of technical realization of hermetically sealed transparent cavity and its enclosure

Sep 16, 2022

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Technical implementation elements:


7. The present invention is based on the development progress made by SCHOTT. The invention therefore consists in improving the capsule and in particular making it more robust. As a result, the stability can be increased with respect to environmental influences and, for example, mechanical loads.

8. Another sub-solution of the present invention is to improve the separation of the capsules to reduce the probability of breakage of the corners and edges of the capsules, ie to achieve a more stable capsule as well.

9. On the basis that material properties such as biocompatibility and material combinations are decisive for subsequent applications, a further sub-solution of the invention is ultimately to reduce the number of materials and/or composite materials to be used.

10. Another sub-aspect of the present invention is to provide an enclosure which can have any outer contour.

11. The use of eg photolithographic processes opens up degrees of freedom beyond what conventional separation processes, eg wafer dicing, allow. Thus, for example, nearly arbitrary geometric contours can be produced and thus can be adapted to existing complementary structures, as commonly found in biology, in particular cavities in bone structures as an example.

12. In other words, the first object of the present invention is to provide a better enclosure for the cavity to withstand harsher environmental conditions and influences, and the second object is to be able to choose the outer shape for the enclosure as freely as possible or profile and/or size.

13. Another aspect of the present invention is to provide an improvement to the capsule which is particularly cost effective, but reliable and has a long service life, since the improved capsule must also stand out in the market competition.

14. A method for providing a plurality of hermetically sealed enclosures is therefore proposed in the present invention. Although the method can be modified without difficulty so that only a single capsule is produced by means of this method, it makes economical sense to produce a plurality of capsules in the same process flow, since time, effort and raw materials can thereby be saved.

15. A hermetically sealed enclosure according to the present invention comprising at least one base substrate and cover substrates, ie a first substrate and a second substrate, which form at least part of the enclosure. The enclosure also includes at least one functional area surrounded by the enclosure, in particular a hermetically sealed receiving chamber for receiving contents, such as electronic circuits, sensors or mems.

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