Custom Steel Camping Bent Tubing Service
Specifications: customized according to the requirements of drawings and samples
Introduction: Professional hardware accessories processing factory
Description
Technical Parameters
custom steel camping bent tubing serviceProduct Description |
| Material | Aluminum(6061-T6, 6063, 7075-T6, 5052)etc... Brass/Copper/Bronze etc... Stainless Steel(302,303,304,316,420)etc... Steel(mild stee, Q235,20#,45#)etc... Plastic(ABS, Delrin,PP,PE,PC, Acrylic) etc... |
| Process | CNC Machining, CNC Turning, CNC Milling, CNC Lathe Mahining, CNC Boring, CNC Grinding, CNC Drilling etc... |
| Surface Treatment | Clear/Color Anodized; Hard Anodized; Powder-coating; Sand-blasting; Painting; Nickel Plating; Chrom Plating; Zinc Plating; Silver/Gold Plating; Black Oxide Coating; Polishing; etc... |
| Term of Payment | T/T, Paypal, Trade Assurance etc... |
| Minimum Order | Complay with customer's demand |
| Delivery Way | Express(DHL, Fedex, UPS, TNT, EMS); By Air; By Sea; or on your requirements |
| Products Show |
| Contact Us |
Shenzhen pride Industrial Co., Ltd.
Block D, Dianlian Science Park, Matian St., Guangming District, Shenzhen 518106, China
crush@pride-cnc.com
+86-917-3387002
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latest news:
The world's first transistor
Counting from the advent of the first transistor, the development of semiconductor technology has been more than half a century, and it still maintains a strong development trend. It continues to follow Moore's law that the chip integration will double in 18 months, and the device size will be doubled every three years. The speed of development is reduced by 0.7 times. IC production with large size, fine line width, high precision, high efficiency, and low cost is bringing unprecedented challenges to semiconductor equipment.
In the manufacturing process, integrated circuits have undergone multiple processes such as material preparation, masking, photolithography, cleaning, etching, impregnation, and chemical mechanical polishing. Among them, photolithography is the most critical process, which determines the advanced level of the manufacturing process. With the development of integrated circuits from the micron level to the nanometer level, the wavelength of light used in lithography has also changed from the 436nm and 365nm wavelengths in the near ultraviolet (NUV) range to the 248nm and 193nm wavelengths in the deep ultraviolet (DUV) range. At present, most chip manufacturing processes use 248nm and 193nm lithography technology. At present, the research on EUV extreme ultraviolet lithography technology with a wavelength of 13.5nm is also advancing rapidly.
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