Metal housing materials commonly used in the electronic packaging industry

Aug 03, 2022

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As a commonly used metal shell material in the electronic packaging industry, KOVAR parts have a linear expansion coefficient close to that of molybdenum group glass and can generate a small sealing stress during the sealing (melting) process with molybdenum group glass, so To obtain good airtightness, in order to make the metal tube and shell achieve airtight sealing, the annealing process undoubtedly plays an important role in the whole sealing process. It not only eliminates the pre-production of metal parts The internal stress generated in the processing also prepares the material structure for the implementation of the metal parts in the subsequent process - the sealing process. When Kovar undergoes plastic deformation during cold working, about 10% to 15% of the applied energy is converted into internal energy, that is, the so-called internal stress, so that the Kovar material organization is in an unstable state, at room temperature. , this state can be maintained for a long time without significant changes. If it is heated, a series of changes in structure and properties will occur, making the material structure tend to be in a stable state. The changes in structure and properties, especially the changes in structure, are reflected on the sealing surface, which is the high temperature sealing. The tensile stress on the molybdenum group glass during the connection may cause micro-cracks in the glass and air leakage; during the cold working process of Kovar parts, due to defects such as grain elongation and grain breakage in the internal material structure, the crystal Defects increase greatly and dislocation density increases.

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