Manufacturing method of disc-shaped package substrate edger

1. The utility model relates to a disc-shaped package substrate edger.

Background technique:

2. In the rectifier diode, the disk-shaped package substrate needs to be polished into a truncated cone shape. In the prior art, a sandblasting process is generally used, that is, compressed air is used to spray abrasive sand onto the surface of the package substrate at a high speed. The abrasive sand polishes the surface of the package substrate under high pressure, so that the package substrate is gradually polished into a truncated cone shape. However, the use of the sandblasting process cannot well control the degree of polishing and the polishing range of the package substrate, and it is easy to cause excessive polishing to damage the package substrate.

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